Shenzhen Adhesive Expo, Hall 16 - 14C60

The "BOND 2026 7th Shenzhen Adhesive Expo" will focus on showcasing the latest products and technologies in the adhesives and sealants industry. It aims to help companies build their brand image, promote trade and business development, lead industry trends, strengthen the interaction between production, R&D, and sales, and gain deep insights into the future trends of the domestic and international adhesives and sealants market. With a forward-looking perspective, it will explore new market demands in adhesives and sealants, innovate the essence of the expo, and organize professional visitors in a comprehensive and multi-level manner. The expo provides an ideal platform for technical exchange, product display, and business negotiations. The 7th BOND Shenzhen Adhesive Expo will be held at the Shenzhen International Convention and Exhibition Center from June 10 to 12, 2026. We warmly welcome adhesive and sealant companies, as well as professionals from related industries, to come and visit!